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author | Takashi Iwai <tiwai@suse.de> | 2010-08-18 15:17:30 +0200 |
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committer | Takashi Iwai <tiwai@suse.de> | 2010-08-18 15:17:30 +0200 |
commit | 6ab561c8aab2e4af535f09adbc6253f958536848 (patch) | |
tree | 37846adb4ea106485720d113e252d71d615c23ed /Documentation/hwmon/w83792d | |
parent | 4f4e8f69895c8696a4bcc751817d4b186023ac44 (diff) | |
parent | cbaa9f60d5d5c3af10f94e0d49789d5b82341a4a (diff) |
Merge branch 'topic/isa' into topic/misc
Diffstat (limited to 'Documentation/hwmon/w83792d')
-rw-r--r-- | Documentation/hwmon/w83792d | 2 |
1 files changed, 1 insertions, 1 deletions
diff --git a/Documentation/hwmon/w83792d b/Documentation/hwmon/w83792d index 14a668ed8aa..8a023ce0b72 100644 --- a/Documentation/hwmon/w83792d +++ b/Documentation/hwmon/w83792d @@ -5,7 +5,7 @@ Supported chips: * Winbond W83792D Prefix: 'w83792d' Addresses scanned: I2C 0x2c - 0x2f - Datasheet: http://www.winbond.com.tw/E-WINBONDHTM/partner/PDFresult.asp?Pname=1035 + Datasheet: http://www.winbond.com.tw Author: Chunhao Huang Contact: DZShen <DZShen@Winbond.com.tw> |