Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management update from Zhang Rui:
 "Highlights:

   - Introduction of thermal policy support, together with three new
     thermal governors, including step_wise, user_space, fire_share.

   - Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson
     db8500_cpufreq_cooling driver.

   - Thermal Kconfig file and Makefile refactor.

   - Fixes for generic thermal layer, generic cpucooling, rcar thermal
     driver and Exynos thermal driver."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  Thermal: Fix DEFAULT_THERMAL_GOVERNOR
  Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
  thermal: rcar: add rcar_zone_to_priv() macro
  thermal: rcar: fixup the unit of temperature
  thermal: cpu cooling: allow module builds
  thermal: cpu cooling: use const parameter while registering
  Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
  Thermal: Add ST-Ericsson DB8500 thermal driver.
  drivers/thermal/Makefile refactor
  Exynos: Add missing dependency
  Refactor drivers/thermal/Kconfig
  thermal: cpu_cooling: Make 'notify_device' static
  Thermal: Remove the cooling_cpufreq_list.
  Thermal: fix bug of counting cpu frequencies.
  Thermal: add indent for code alignment.
  thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
  thermal: user_space: Add missing static storage class specifiers
  thermal: fair_share: Add missing static storage class specifiers
  thermal: step_wise: Add missing static storage class specifiers
  Thermal: Fix oops and unlocking in thermal_sys.c
  ...

2 files changed, 108 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
new file mode 100644
index 00000000000..2e1c06fad81
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
@@ -0,0 +1,44 @@
+* ST-Ericsson DB8500 Thermal
+
+** Thermal node properties:
+
+- compatible : "stericsson,db8500-thermal";
+- reg : address range of the thermal sensor registers;
+- interrupts : interrupts generated from PRCMU;
+- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
+- num-trips : number of total trip points, this is required, set it 0 if none,
+  if greater than 0, the following properties must be defined;
+- tripN-temp : temperature of trip point N, should be in ascending order;
+- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
+  "critical";
+- tripN-cdev-num : number of the cooling devices which can be bound to trip
+  point N, this is required if trip point N is defined, set it 0 if none,
+  otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
+
+Usually the num-trips and tripN-*** are separated in board related dts files.
+
+Example:
+thermal@801573c0 {
+	compatible = "stericsson,db8500-thermal";
+	reg = <0x801573c0 0x40>;
+	interrupts = <21 0x4>, <22 0x4>;
+	interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+
+	num-trips = <3>;
+
+	trip0-temp = <75000>;
+	trip0-type = "active";
+	trip0-cdev-num = <1>;
+	trip0-cdev-name0 = "thermal-cpufreq-0";
+
+	trip1-temp = <80000>;
+	trip1-type = "active";
+	trip1-cdev-num = <2>;
+	trip1-cdev-name0 = "thermal-cpufreq-0";
+	trip1-cdev-name1 = "thermal-fan";
+
+	trip2-temp = <85000>;
+	trip2-type = "critical";
+	trip2-cdev-num = <0>;
+}
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index ca1a1a34970..88c02334e35 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -112,6 +112,29 @@ temperature) and throttle appropriate devices.
     trip: indicates which trip point the cooling devices is associated with
 	  in this thermal zone.
 
+1.4 Thermal Zone Parameters
+1.4.1 struct thermal_bind_params
+    This structure defines the following parameters that are used to bind
+    a zone with a cooling device for a particular trip point.
+    .cdev: The cooling device pointer
+    .weight: The 'influence' of a particular cooling device on this zone.
+             This is on a percentage scale. The sum of all these weights
+             (for a particular zone) cannot exceed 100.
+    .trip_mask:This is a bit mask that gives the binding relation between
+               this thermal zone and cdev, for a particular trip point.
+               If nth bit is set, then the cdev and thermal zone are bound
+               for trip point n.
+    .match: This call back returns success(0) if the 'tz and cdev' need to
+	    be bound, as per platform data.
+1.4.2 struct thermal_zone_params
+    This structure defines the platform level parameters for a thermal zone.
+    This data, for each thermal zone should come from the platform layer.
+    This is an optional feature where some platforms can choose not to
+    provide this data.
+    .governor_name: Name of the thermal governor used for this zone
+    .num_tbps: Number of thermal_bind_params entries for this zone
+    .tbp: thermal_bind_params entries
+
 2. sysfs attributes structure
 
 RO	read only value
@@ -126,6 +149,7 @@ Thermal zone device sys I/F, created once it's registered:
     |---type:			Type of the thermal zone
     |---temp:			Current temperature
     |---mode:			Working mode of the thermal zone
+    |---policy:			Thermal governor used for this zone
     |---trip_point_[0-*]_temp:	Trip point temperature
     |---trip_point_[0-*]_type:	Trip point type
     |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
@@ -187,6 +211,10 @@ mode
 			  charge of the thermal management.
 	RW, Optional
 
+policy
+	One of the various thermal governors used for a particular zone.
+	RW, Required
+
 trip_point_[0-*]_temp
 	The temperature above which trip point will be fired.
 	Unit: millidegree Celsius
@@ -264,6 +292,7 @@ method, the sys I/F structure will be built like this:
     |---type:			acpitz
     |---temp:			37000
     |---mode:			enabled
+    |---policy:			step_wise
     |---trip_point_0_temp:	100000
     |---trip_point_0_type:	critical
     |---trip_point_1_temp:	80000
@@ -305,3 +334,38 @@ to a thermal_zone_device when it registers itself with the framework. The
 event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,
 THERMAL_DEV_FAULT}. Notification can be sent when the current temperature
 crosses any of the configured thresholds.
+
+5. Export Symbol APIs:
+
+5.1: get_tz_trend:
+This function returns the trend of a thermal zone, i.e the rate of change
+of temperature of the thermal zone. Ideally, the thermal sensor drivers
+are supposed to implement the callback. If they don't, the thermal
+framework calculated the trend by comparing the previous and the current
+temperature values.
+
+5.2:get_thermal_instance:
+This function returns the thermal_instance corresponding to a given
+{thermal_zone, cooling_device, trip_point} combination. Returns NULL
+if such an instance does not exist.
+
+5.3:notify_thermal_framework:
+This function handles the trip events from sensor drivers. It starts
+throttling the cooling devices according to the policy configured.
+For CRITICAL and HOT trip points, this notifies the respective drivers,
+and does actual throttling for other trip points i.e ACTIVE and PASSIVE.
+The throttling policy is based on the configured platform data; if no
+platform data is provided, this uses the step_wise throttling policy.
+
+5.4:thermal_cdev_update:
+This function serves as an arbitrator to set the state of a cooling
+device. It sets the cooling device to the deepest cooling state if
+possible.
+
+5.5:thermal_register_governor:
+This function lets the various thermal governors to register themselves
+with the Thermal framework. At run time, depending on a zone's platform
+data, a particular governor is used for throttling.
+
+5.6:thermal_unregister_governor:
+This function unregisters a governor from the thermal framework.