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authorDavid S. Miller <davem@davemloft.net>2014-05-16 22:29:17 -0400
committerDavid S. Miller <davem@davemloft.net>2014-05-16 22:29:17 -0400
commita8d0d8417c0bdc870d28afb83bc12e61a818efa3 (patch)
treec9c13fc99aaa8f2c62d21b5ffbb1ece6d1a2c00b /drivers/net/ethernet/broadcom
parent6bd64ac0f9c264082241da0db0dcc72a13e672a8 (diff)
parentf60c3704e87d39356d00c71bf51e55c2c55ad4f5 (diff)
Merge branch 'bond_stacked_vlans'
Vlad Yasevich says: ==================== Fixed stacked vlan usage on top of bonds Bonding device driver now support q-in-q on top for bonds. There are a few issues here though. First, when arp monitoring is used, bonding driver will not correctly tag traffic if the source of the arp device was configured on top of q-in-q. It may also incorrectly pick the wrong vlan id if the ordering of that upper devices isn't as expected (there is no guarntee on ordering). Second, the alb/tlb may use what would be considered 'inner' vlans in its learning announcements, as it simply announces all vlans configured on top of the bond without regard for encapsulation/stacking. This series fixes the above 2 issues. This series also depends on the functionality introduced in http://patchwork.ozlabs.org/patch/349766/ Since v1: - Changed how patch1 verifies the device path. We no longer use the _all_upper version of the function. We find the path and if it was found, then collect the vlan information. - Use the constant to devine maximum vlan nest level support on top of bonding. This can be changed if 2 is too low. - Inlude patch2 into the series. ==================== Signed-off-by: David S. Miller <davem@davemloft.net>
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