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authorMichal Nazarewicz <m.nazarewicz@samsung.com>2010-08-12 17:43:48 +0200
committerGreg Kroah-Hartman <gregkh@suse.de>2010-10-22 10:21:22 -0700
commitfc19de61ef5c17b6e19766052c6ac85cf31de876 (patch)
tree62c25db2b0792779226daa3141057808d494ae4f /include/linux/usb/composite.h
parent9cfe745e652eacf57ffc7862b7b3ccbdf336ad19 (diff)
USB: gadget: functionfs: code cleanup
This patch removes some of the string registration from the FunctionFS Gadget as composite layer can handle the iManufacturer and iProduct for us. It also removes some of the module parameters which were redundant as well as changes the name of others to better much the module parameter of the composite layer. Other then that, it also fixes formatting of multiline comments to match the coding style. Signed-off-by: Michal Nazarewicz <m.nazarewicz@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Diffstat (limited to 'include/linux/usb/composite.h')
0 files changed, 0 insertions, 0 deletions