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The functions cpufreq_cooling_unregister() and thermal_zone_device_unregister()
test whether their argument is NULL and then return immediately.
Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch fixes a compilation warning.
warning: passing argument 5 of 'thermal_zone_device_register' discards 'const'
qualifier from pointer target type [enabled by default]
include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *'
but argument is of type 'const struct thermal_zone_device_ops *'
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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exynos_report_trigger()
The commit 4de0bdaa9677d11406c9becb70c60887c957e1f0
("thermal: exynos: Add support for instance based register/unregister")
broke check for presence of therm_dev at global thermal zone in
exynos_report_trigger().
The resulting wrong test prevents thermal_zone_device_update() call, which
calls handlers for situation when trip points are passed.
Such behavior prevents thermal driver from proper reaction (when TMU interrupt
is raised) in a situation when overheating is detected at TMU hardware.
It turns out, that after exynos thermal subsystem redesign (at v3.12) this
check is not needed, since it is not possible to register thermal zone
without valid thermal device.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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NULL pointer was being dereferenced in its own error message.
Changed it to the correct device pointer.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This patch uses the device pointer stored in the configuration structure
and converts to dev_* prints and devm API's.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This code simplifies the zone handling to use the trip information passed
by the TMU driver and not the hardcoded macros. This also helps in adding
more zone support.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This patch removes the error return in the bind/unbind routine
as the platform may not register any cpufreq cooling data.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This patch renames member private_data to driver_data of the thermal
zone registration structure as this item stores the driver related
data and uses it to call the driver related callbacks.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This code modifies the thermal driver to have multiple thermal zone
support by replacing the global thermal zone variable with device data
member of thermal_zone_device.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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