From d28a9689c93195d39f91f35a9519876688605b65 Mon Sep 17 00:00:00 2001 From: Anton Tikhomirov Date: Wed, 15 Feb 2012 17:04:56 +0900 Subject: usb: dwc3: Add Exynos Specific Glue layer Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov Signed-off-by: Felipe Balbi --- drivers/usb/dwc3/Makefile | 13 +++++++++++++ 1 file changed, 13 insertions(+) (limited to 'drivers/usb/dwc3/Makefile') diff --git a/drivers/usb/dwc3/Makefile b/drivers/usb/dwc3/Makefile index 900ae74357f..d441fe4c180 100644 --- a/drivers/usb/dwc3/Makefile +++ b/drivers/usb/dwc3/Makefile @@ -28,6 +28,19 @@ endif obj-$(CONFIG_USB_DWC3) += dwc3-omap.o +## +# REVISIT Samsung Exynos platform needs the clk API which isn't +# defined on all architectures. If we allow dwc3-exynos.c compile +# always we will fail the linking phase on those architectures +# which don't provide clk api implementation and that's unnaceptable. +# +# When Samsung's platform start supporting pm_runtime, this check +# for HAVE_CLK should be removed. +## +ifneq ($(CONFIG_HAVE_CLK),) + obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o +endif + ifneq ($(CONFIG_PCI),) obj-$(CONFIG_USB_DWC3) += dwc3-pci.o endif -- cgit v1.2.3-70-g09d2