diff options
| author | Felipe Balbi <balbi@ti.com> | 2013-02-06 09:24:55 +0200 |
|---|---|---|
| committer | Felipe Balbi <balbi@ti.com> | 2013-03-18 11:17:06 +0200 |
| commit | 787f5627bec80094db487bfcb401e9744f181aed (patch) | |
| tree | 9352b4e9fa484e2899975f81984740ea8665948d /include/asm-generic/exec.h | |
| parent | 99b7856f3cec5db7ec71a8b4675a63e4bcadd63e (diff) | |
usb: musb: make davinci and da8xx glues depend on BROKEN
those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.
Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.
For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'include/asm-generic/exec.h')
0 files changed, 0 insertions, 0 deletions